A 1-mil polyester film tape with a pressure sensitive silicone adhesive system.

Designed to perform in masking applications requiring high chemical resistance. Also excellent for splicing applications requiring silicone adhesives.

A 1-mil polyester film with a pressure sensitive silicone adhesive system.

Designed to perform in most masking applications in the production of printed circuit boards. Protects against splashes and fumes from the chemicals used in tin/lead stripping and gold finger plating operations.

A 1-mil polyester film with a pressure sensitive rubber thermoset adhesive system.

An excellent low tack protective tape. Protects the printed circuit board and copper from foreign parts and chemical attacks.

A 1-mil polyester film with a pressure sensitive silicone thermoset adhesive system.

Designed to perform in masking applications requiring high chemical resistance. Also excellent for splicing applications requiring high performance silicone adhesives.

A 1-mil polyester film backing with a silicone pressure sensitive adhesive system. Engineered for applications requiring no/low residue.

Designed to perform in all phases of masking operations for printed circuit board production. Protects circuitry from splashes and chemical fumes.

A 1 mil polyester film tape with a high performance silicone pressure sensitive adhesive system

Quick stick silicone adhesive, removes cleanly.

A 1-mil polyester film backing with a silicone pressure sensitive adhesive system.

Designed to perform in all phases of masking operations for printed circuit board production. Protects circuitry from splashes and chemical fumes. Engineered for applications requiring no/low residue.

A 1-mil polyester film tape with a pressure sensitive silicone adhesive system.

May be used in a wide variety of masking operations where conformability and clean, no residue, removal is critical. Can also be used in a variety of splicing applications.

A 1-mil polyester film backing with a pressure sensitive silicone adhesive system. This product is engineered for applications where no/low residue is a requirement.

Designed to perform in all phases of masking operations for printed circuit board production. Protects circuitry from splashes and chemical fumes.

A 1-mil polyimide film with a silicone pressure sensitive adhesive system.

Engineered to protect gold fingers during the wave solder process.

A 2-mil polyimide film with a silicone pressure sensitive adhesive system.

Engineered to protect gold fingers during the wave solder process.