High Temperature Masking
Displaying all products from product market Industrial >High Temperature Masking
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9144 | A 1-mil polyester film with a pressure sensitive silicone adhesive system.
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Designed to perform in most masking applications in the production of printed circuit boards. Protects against splashes and fumes from the chemicals used in tin/lead stripping and gold finger plating operations.
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9180 | A 1-mil polyester film backing with a silicone pressure sensitive adhesive system. Engineered for applications requiring no/low residue.
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Designed to perform in all phases of masking operations for printed circuit board production. Protects circuitry from splashes and chemical fumes.
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9182 | 9182 is a 1 mil polyester film tape with a high performance silicone pressure sensitive adhesive system. |
Quick stick silicone adhesive, removes cleanly. |
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9185 | A 1-mil polyester film backing with a silicone pressure sensitive adhesive system.
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Designed to perform in all phases of masking operations for printed circuit board production. Protects circuitry from splashes and chemical fumes. Engineered for applications requiring no/low residue.
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9190 | A 1-mil polyester film backing with a pressure sensitive silicone adhesive system. This product is engineered for applications where no/low residue is a requirement.
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Designed to perform in all phases of masking operations for printed circuit board production. Protects circuitry from splashes and chemical fumes.
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9209 | 2 mil polyester film coated with 1.3 mils of silicone adhesive.
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Designed to perform in a variety of splicing applications where chemical resistance and resistance to heat degradation are desired.
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9210 | 2 mil polyester film coated with 1.3 mils of silicone adhesive.
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Designed to perform in a variety of splicing applications where chemical resistance and resistance to heat degradation are desired.
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9213 | 2 mil polyester film coated with 1.3 mils of silicone adhesive.
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Designed to perform in a variety of splicing applications where chemical resistance and resistance to heat degradation are desired.
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9244 | 2 mil polyester film coated with 1.3 mils of silicone adhesive.
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Designed to perform in a variety of splicing applications where chemical resistance and resistance to heat degradation are desired.
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9249 | 2 mil polyester film backing with a 1.3 mil silicone pressure sentisive adhesive system engineered for low/no residue applications.
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High temperature masking applicatons.
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9321 | A 1-mil polyimide film with a silicone pressure sensitive adhesive system.
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Engineered to protect gold fingers during the wave solder process.
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