High Temperature Masking

Displaying all products from product market Industrial >High Temperature Masking

Product Description Suggested end-use
9144
A 1-mil polyester film with a pressure sensitive silicone adhesive system.
Designed to perform in most masking applications in the production of printed circuit boards. Protects against splashes and fumes from the chemicals used in tin/lead stripping and gold finger plating operations.
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9180
A 1-mil polyester film backing with a silicone pressure sensitive adhesive system. Engineered for applications requiring no/low residue.
Designed to perform in all phases of masking operations for printed circuit board production. Protects circuitry from splashes and chemical fumes.
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9182
9182 is a 1 mil polyester film tape with a high performance silicone pressure sensitive adhesive system.
Quick stick silicone adhesive, removes cleanly.
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9185
A 1-mil polyester film backing with a silicone pressure sensitive adhesive system.
Designed to perform in all phases of masking operations for printed circuit board production. Protects circuitry from splashes and chemical fumes. Engineered for applications requiring no/low residue.
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9190
A 1-mil polyester film backing with a pressure sensitive silicone adhesive system. This product is engineered for applications where no/low residue is a requirement.
Designed to perform in all phases of masking operations for printed circuit board production. Protects circuitry from splashes and chemical fumes.
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9209
2 mil polyester film coated with 1.3 mils of silicone adhesive.
Designed to perform in a variety of splicing applications where chemical resistance and resistance to heat degradation are desired.
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9210
2 mil polyester film coated with 1.3 mils of silicone adhesive.
Designed to perform in a variety of splicing applications where chemical resistance and resistance to heat degradation are desired.
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9213
2 mil polyester film coated with 1.3 mils of silicone adhesive.
Designed to perform in a variety of splicing applications where chemical resistance and resistance to heat degradation are desired.
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9244
2 mil polyester film coated with 1.3 mils of silicone adhesive.
Designed to perform in a variety of splicing applications where chemical resistance and resistance to heat degradation are desired.
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9249
2 mil polyester film backing with a 1.3 mil silicone pressure sentisive adhesive system engineered for low/no residue applications.
High temperature masking applicatons.
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9321
A 1-mil polyimide film with a silicone pressure sensitive adhesive system.
Engineered to protect gold fingers during the wave solder process.
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